CRANSTON, RI — (Marketwire) — 01/25/12 — Technic Inc. has announced the commercial release of the first products to be marketed under the gold reduction technology platform: and barrier layer electroplating processes for connector applications.
provides a pure, ductile, low-stress nickel deposit with excellent thickness distribution. By depositing a more uniform nickel layer underneath the gold deposit, the corrosion properties of the overall coating system are improved. The process produces an electrodeposited nickel-phosphorous (Ni-P) alloy containing 6-11% phosphorous. The incorporation of phosphorous in the nickel deposit results in a significant improvement in the corrosion resistance.
Optimal performance is obtained through use of a duplex barrier layer system consisting of pure nickel deposit from the process, followed by nickel-phosphorous electroplated from .
„Both Techni Nickel HT-2 and Techni NiPhos 611 barrier layer coatings can dramatically enhance the corrosion resistance of gold plated contacts, which in turn enables lower gold thicknesses to be plated without any sacrifice in functionality. No modifications are required to implement these barrier layer coatings in existing reel-to-reel plating lines and no special rectification is needed. Techni Nickel HT-2 and Techni NiPhos 611 are true „drop-in“ replacements for existing nickel sulfamate solutions commonly used in the industry.“ – Rob Schetty, VP, Technic Advanced Technology Division
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Technic, Inc. is a US based, private, financially strong corporation. For over 65 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the electronic component, printed circuit board, semiconductor, photovoltaic, industrial finishing and decorative industries.
For information on Technic & Technic products go to: or contact Technic at (401) 781-6100.
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Press release contact: Bob Sheeran Technic Inc.
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