CRANSTON, RI — (Marketwire) — 01/25/12 — Technic Inc. has announced the commercial release of the first products to be marketed under the gold reduction technology platform: and barrier layer electroplating processes for connector applications.provides a pure, ductile, low-stress nickel deposit with excellent thickness distribution. By depositing a more uniform nickel layer underneath the gold deposit, the corrosion properties of the overall coating system are improved. The process produ
New High Throw, Low Cost Tin Process for Improving Yields of Advanced PCB Designs
