MUNICH, 1 July, 2013 – ERS electronic GmbH, the innovation leader for thermal wafer chucks in semiconductor production, will introduce advanced chilling technology for its AirCool3 modular thermal chuck system at the Semicon West in San Francisco. The new technology will enable ERS AirCool system to be used on 450mm wafer chucks without loss of chilling power or increase in test floor footprint.
The stronger performance of the new chiller system stems from ERS"s 43-year experience in therm
