MUNICH, 1 July, 2013 – ERS electronic GmbH, the innovation leader for thermal wafer chucks in semiconductor production, will introduce advanced chilling technology for its AirCool3 modular thermal chuck system at the Semicon West in San Francisco. The new technology will enable ERS AirCool system to be used on 450mm wafer chucks without loss of chilling power or increase in test floor footprint.
The stronger performance of the new chiller system stems from ERS“s 43-year experience in thermal test and specifically in a new electronics control circuitry that more fully exploits the chilling power of the standard refrigeration system at the core of the air-cooled system.
The new system will easily master the larger thermal mass of a 450mm chuck bringing the built-in economy, flexibility, compactness and unmatched reliability of the patented ERS AirCool plus thermal chuck technology.
„The introduction of the new system proves that ERS is ready for the 450mm transition in the semiconductor industry“, said ERS electronics General Manager Klemens Reitinger. „It not only enables users to perform checks in the full analytical temperature range but also offers the ability to drive peripheral components of the test cell.“
Beta versions of the new chiller system are already running in production at customer sites around the world. ERS factory manufacturing levels for chillers with this new technology will match current technology by the end of the year.
Semicon West will take place from July 9-11 at the Moscone Center, San Francisco, Calif. ERS can be found in the North Hall, Booth 6277.
For more information visit www.ers-gmbh.com
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