MUNICH, May 28, 2013 – ERS electronic GmbH, the innovation leader in the market of thermal wafer chucks in semiconductor production, will show its spectrum of wafer chuck systems at the Philippine Semiconductor and Electronics Convention and Exhibition (PSECE). In the spotlight of ERS- presence at the event is the innovative ERS AirCool3 modular chuck system.
During the event, which will take place from June 5 – 7, ERS electronic will speak on thermal testing of semiconductors at the wafer lev
MUNICH – December 5, 2012 – One and half a year after its launch, ERS electronic GmbH-s FOWLP (Fan-out Wafer Level Packaging) competence center near Munich (Germany) is being utilized by an increasing number of semiconductor chip makers, research institutes, materials suppliers and packaging sub-contractors. The ERS lab provides the opportunity to utilize ERS- latest tools for production processes associated with eWLB (embedded Wafer Level BGA) and other FOWLP applications. The applications now
