X-ES Introduces Rugged COM Express(R) Module With 3rd Generation Intel(R) Core(TM) i7 Processor for Small Form Factor Systems 0

MIDDLETON, WI — (Marketwire) — 05/03/12 — Extreme Engineering Solutions, Inc. (X-ES) introduces , a rugged COM Express® module that complies with the PICMG COM Express Basic form factor (95mm x 125mm) and supports an enhanced Type 6 pinout. The XPedite7450 can be hosted on a standard COM Express carrier card or a custom carrier card built to include additional end-user requirements, or it can be integrated into an X-ES . Based on the 3rd generation Intel® Core i7 quad-core processor