Heraeus has registered a trademark for its Celcion(R) Thick Film material system. This step shows the importance of the system for the LED market and the significance Heraeus attaches to it.
The Celcion® Thick Film material system was developed to affix circuits directly to aluminium substrates. With the innovative material system, LEDs are mounted more economically than on conventional MCPCBs (metal-core printed circuit boards).
System comparison The conventional way is to wire LEDs on MCPCBs. This is a subtractive process, i.e. a process based on the removal of material. Apart from the time required, this production process consumes much raw material because the entire surface is pre-coated with an expensive insulating material and afterwards the unnecessary areas are removed.
In contrast to MCPCBs, the Celcion® system is a selective assembly process in which paste is applied only to the places where it is needed. This means fewer processing steps and reduced material consumption. Moreover, as thinner layers can be used, the overall cost is lower.
Reduced costs and at the same time 5 to 10°C cooler Independent tests carried out by industry have shown that Celcion® has a better thermal conductivity and a higher dielectric break down strength compared to conventional MCPCBs. All materials can be fired at a temperature of less than 600°C and are compatible with the most varied aluminium types.
As Celcion® circuits are about 5 to 10°C cooler in operation they have a longer service light at identical light intensities. Conversely, this means that at the same temperature, designers can increase the light output by 20% with the same space coverage (or identical circuit size). This, in turn, lowers production costs.
