The Precious Metal and Technology Group Heraeus will take full advantage of its participation in the SEMICON Korea 2011, to be held between January 26th and 28th in Seoul/Korea, to present its most newly developed products for use in assembly and packaging technologies within the electronics industry (Booth 5127, Hall D). The SEMICON Korea is the world“s largest trade fair to feature machines, plant equipment and materials involved in the manufacture of semiconductors.
Heraeus, represented through the local presence of Heraeus Oriental HiTec Co., Ltd., will exhibit its very latest solutions relating to bonding wire technology and introduce several different bonding wires which also serve as electrically conductive connections between the semiconductor components and the system carriers. The basic materials for these fine and ultrafine wires are gold, copper and aluminum. Over the years the Heraeus Bonding Wire Unit has successively achieved its target to occupy a leading position in the global bonding wire market, and its name is equated with products of the highest quality and process stability. A total of five separate Asian production sites enable Heraeus to manufacture directly on the spot for the most varying branches of industry.
The Heraeus exhibition team is looking forward to greeting you at Booth 5127 in Hall D.
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