The precious metal and technology group Heraeus is to present innovative new products in the field of assembly systems and packaging technology for the electronics industry at this year“s SEMICON Japan 2010. The exhibition takes place from December 1st to 3rd in Chiba/Japan.
The SEMICON Japan is the world“s largest fair encompassing machinery, equipment and materials vital to the manufacture of semiconductors. Heraeus is represented by the Contact Materials Division and will take this opportunity to introduce its cutting edge solutions based on bonding wire technology.
Heraeus will exhibit various bonding wires which act as electrically conductive connections between semiconductor devices and system carriers. The basis material for these fine and ultrafine wires is gold, copper and aluminium. The Heraeus bonding wire business unit has successfully targeted over many years a leading position in the global market for bonding wires, and stands for the highest possible quality and process stability. A total of five Asian production sites enable Heraeus to be right on the spot to produce locally for a multitude of different industries.
With just as many years proven experience in the manufacture of solder pastes, Heraeus is in a position to provide specialized solutions with unique properties. The lead-free solder pastes InnoRelTM belong to the Heraeus range of „green“ top products and serve to increase both reliability and operating temperature alike.
Come and get to know Heraeus and experience the vast product range for yourselves. Indulge in and enjoy some stimulating and informative discussions with our experts. The Heraeus team is waiting to greet and look after you at Booth 411 in Hall 8A.
