Heraeus will be represented at the IPC APEX Expo (19 – 21 February 2013, San Diego) with its portfolio of materials for assembly and packaging technology in the electronics industry.
A main highlight will be the new lead free solder paste SOP 91121. It is a newly developed product in the Heraeus line of no clean solder pastes for surface mount technology. This paste is compatible with a variety of reflow methods e.g. convection, vapor phase and vacuum systems. This flux platform is compatible with different alloys like SAC305, SAC105 low silver and SAC0307 lowest silver. For high reliability automotive or industrial applications it is also available with INNOLOT alloy. The solder paste provides industry leading wetting and outstanding void performance on a variety of component terminations and surface finishes, as well as long stencil life and tack time. Another advantage is the low amount of very clear flux residues.
The new developed F590 is the latest development of our water soluble halogen free solder paste series for a variety of PCB or packaging application. This latest development is compatible with the major lead and lead free alloys known. The F590 series has excellent wetting properties in combination with halogen free flux. The residues are easy to clean with DI water.
Heraeus mAgic products The launch of the sinter products named Microbond Ag Interconnect (mAgic) is another innovation presented by Heraeus. These sinter pastes are currently used in high volume production and demonstrate their outstanding performance in high power converters every day. Especially applications such as power converters for e-mobility and renewable energy require high power DCB circuits. Heraeus mAgic products can fulfill these requirements and provide highest reliability and superior power density.
The Heraeus no clean and water soluble fluxes are a further highlight at the exhibition. The no clean fluxes are available for a wide range of applications including rework, BGA/CSP ball attach, flip chip attach and wave soldering. These fluxes are offered in liquid, paste or gel forms. Depending on the application, they can be applied with several deposit techniques e.g. spraying, foaming, dipping, pin transfer, printing, and dispensing. The exceptional about water soluble fluxes is the fact that their residues are easily cleaned in DI water and are compatible with most cleaning systems on the market. Heraeus water soluble fluxes feature outstanding wetting on difficult to solder surfaces and are compatible with different finishes and components.
Visit our booth 3040 at the IPC APEX Expo in San Diego from 19 to 21 February 2013.
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