With the exhibition"Gerwald Rockenschaub. multidial", the Kunstmuseum Wolfsburg continues its series of large hall projects that has already featured Olafur Eliasson (2004), Douglas Gordon (2007) and most recently James Turrell (2009).
Introduction to Digital Signal Processing for FPGAs within 3 Days Short Course
For efficiently connecting up to four branches of a FlexRay(TM) Network
DAILY RFID has released mini 125KHz RFID Module designed to embed into any device. It is a high performance, cost-effective reader module designed to enable almost any device to transform into RFID reader. And it has an affordable price under 29 USD per unit.
x, Las Vegas, 06.04.2011 – During APEX 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas, ASTER Technologies, the leading supplier in Board-Level Testability and Test Coverage analysis products, announces the first tool to provide an integrated workflow for DfT and test coverage analysis from design through to mainstream production. Design-For-Test is becoming crucial to ensure complex board performances. In the traditional Design flow, DfT is a specific step after the
Preview for Aegis for SMT Show Nuremberg, Hall 7, booth 7-641
viimagic GmbH expands its product portfolio by the new global shutter HDTV sensors 9221/2 and 9225/6.
Paints and varnishes are not only pretty – they also protect houses, vehicles, and other precious objects against corrosion and decay. Even their mere material value is considerable: “Revenues in Europe will increase to 27.7 billion by 2018,” says Oliver Kutsch, CEO of Ceresana Research. The market research institute is currently publishing a new study on the European paint and varnish market.
They secure tiny electronic components as well as huge wind turbines. They hold both car bodies and trains together. Modern adhesives almost do wonders. “Adhesive bonding has become a key technology in many industrial sectors,” says Oliver Kutsch, CEO of Ceresana Research. The market research institute has scrutinized the European adhesive market from top to bottom.
Fujitsu Semiconductor Europe (FSEU) is pleased to announce the following changes in its senior management structure, effective April 1st 2011.
In a planned succession, Mr. Brendan Mc Kearney, previously Executive Vice President, has assumed the role of President, Fujitsu Semiconductor Europe. Mr. Joji Murakami, who previously held that position, has moved to the new position of Chairman, Fujitsu Semiconductor Europe, and remains a board member of FSEU.
In addition to his new position at Fujits
