Palomar Technologies Exhibits at SEMICON Taiwan 2011 and Offers a Laser Interferometer Technology for Wire Bonder Ultrasonic Calibration System

August 31 22:00 2011

CARLSBAD, CA — (Marketwire) — 08/31/11 — , the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at SEMICON Taiwan 2011 in Taipei from September 7-9 in booth #1006.

The Palomar Technologies Asia-Pacific team has joined forces with . to offer the latest in and at this year-s tradeshow. , Palomar Technologies- Asia-Pacific Director, will be on-site to discuss the latest advancements in systems and process development from Palomar Technologies.

„In order to ensure a seamless transfer of equipment, the Palomar Technologies Asian field services team works closely with customers to cover proper planning, coordination and scheduling. Our customers experience a -plug and play- when the die bonders arrive at their Asian facilities,“ states Chan. „Most of our Asian customers who previously deployed have now entered the second phase of their expansion in production capacity by purchasing new equipment. We have seen an increase in customers- decision to switch over to the to meet new and more challenging packages, such as those requiring .“

Palomar Technologies combines more than 30 years of process know-how with a to ensure their bonders maintain production at peak performance. The provides a non-contact method to check the performance of a wire bonder-s ultrasonic system through . Without calibration, a wire bonder will suffer process inconsistencies. The 2100C makes this calibration an efficient and user-friendly action.

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit .

Mr. PH Chan
Asia Pacific Director
Palomar Technologies

(+65) 6779-2766

Jessica Sylvester
Marketing Communications
Palomar Technologies

+1 (760) 931-3681

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