At this year´s Semicon Taiwan, Heraeus, a leading manufacturer of materials for assembly and connection technology materials, will launch two industry leading bonding wire products PdFLASH and AgLite-HR.
PdFLASHis an outstanding bonding wire with a copper core, coated with Palladium and a flash coating of Gold.. This bonding wire has a significantly more robust 2nd bond performance and a wider 2nd bond process window than a conventional CuPd (Palladium Coated Copper) wire. Additionally it also provides a higher stitch pull strength capablitiy.
AgLite-HRis an extension to the AgLite product launched at the Semicon Taiwan 2012. This specific bonding wire is designed for improved reliability performance required in specific applications. AgLite-HR therefore enables a much broader adoption of Ag-based wires to package assemblies that require more stringent reliability criteria and that are insensitive to slight increases in in electrical resistivity…
PdFLASH is available in diameters ranging from 0.6 – 2.0mils and the extraordinary AgLite-HR from 0.7 to 1.5mils as standard offerings Additional diameters may be available upon request.
Mr. Jack Belani, Vice President of Marketing and Business Development states that „these two products are an example of how Heraeus is enabling the various solutions for its customers who are in the midst of finding alternatives for Gold“
See these products and all the other highlights from Heraeus at the Semicon Taiwan 2013, booth #973, TWTC Nangang Exhibition Hall.
